公司信息,社会责任,新闻,展会活动,行业洞察等等
以集成电路设计为基础,开展以融合通信为平台的技术研发;布局“芯片、软件(模组)、终端、系统、信息服务”产业链,聚焦能源互联网、智能化这两个战略新兴领域,打造国际一流企业
依托成熟的电力线载波通信技术,结合WIFI、蓝牙、RF等通讯方式,开展以融合通信为平台的技术研发,从“芯”开始,构建一个安全、智慧、绿色的智能化系统。
Shanghai Eastsoft Microelectronics Co.,Ltd. Establish procedures to ensure reliability of the products conform to the requirements of the customers. Requirements of company on the basis of AEC - Q100 for validated the reliability of the product
Reliability demonstration project in six groups:
Group A: Accelerated Environment Stress Tests
Group B: Accelerated Lifetime Simulation Tests
Group C: Package Assembly Integrity Tests
Group D: Die Fabrication Reliability Tests
Group E: Electrical Verification Tests
Group F: Defect Screening Tests
Group G: Cavity Package Integrity Tests(Not Applicable)
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